We have invested in a new Nordson Dage Jade FP X-Ray inspection system, significantly enhancing our ability to inspect hidden solder joints.
The system provides:
- High-resolution real-time imaging
- Geometric magnification up to 2000x
- Oblique angle viewing for detailed analysis
- Void measurement and analysis
This investment is particularly important for inspecting:
- Ball Grid Array (BGA) components
- Quad Flat No-lead (QFN) packages
- Hidden solder joints
- Multi-layer PCB internal features
The X-Ray system ensures we can verify the quality of all solder joints, even those that cannot be seen with optical inspection.